Features:

• Compact sized SMARC 2.0 Carrier Board
• Support of x86 based SMARC 2.0 Modules
• Ready-to-use Carrier Board
• Platform for rapid customising
• Support of fast implementation and improved Time-To-Market

Board Variant:
Application Carrier Board for x86 based SMARC 2.0 modules

Internal Connectors and Features:
1x LVDS 18/24bit single/dual channel LVDS
2x optional eDP/DSI (dependent on processor platform)
1x LCD backlight (5V and 12V)
1x SATA Gen3 (support of SATADOM VCC PIN 7 and PIN 8)
1x SATA Power (+5V, +12V)
1x mPCIe full/half size (support for PCIe Gen3 and USB 2.0)
1x M.2 Type E 2230 (I2S, PCIe Gen3, USB 2.0)
1x M.2 Type B 2242/2280 (2x PCIe Gen 3, USB 2.0)
2x MIPI-CSI 1x Micro SIM (muxed between M.2 Type B and mini PCIe)
2x RS 232/422/485 (COM 0 and COM 2 with handshake)
2x RS232 (COM 1 and COM3 TX/RX only)
2x CAN 1x Micro SD card 1x GPIO connector (up to 8 GPIO)
1x Feature connector (Batlow, Charging, GbE SDP, WD)
1x Buttons and LEDs (Power, Reset, Sleep, LID, Power LED, SATA LED)
1x Onboard power button 1x Onboard power state LED
1x SPI/eSPI header
1x I2C header
1x DMIC and analog front panel audio output
1x 12V FAN connector (4-pin)
1x RTC backup (CR2032)
1x Internal DC-In

External Connectors:
2x GbE RJ45
2x USB 2.0
2x USB 3.0/3.1
1x HDMI
1x DP++
1x Audio Jack 4-pin with HDA audio ALC888S-VD
1x External DC-In (12-24V)

Power Specification:
External and internal DC-In (12-24V Wide Range Carrier Board Supply)

Operating Temperature:
Operating Temp: 0°C to +60°C | Storage Temp.: -20°C to +70°C

Humidity:
Operating Hum.: 10% - 90% r. H. non cond. | Storage Hum.: 5% - 95% r. H. non cond.

Size:
146 x 102 mm (approx. 5.75" x 4.02")

Ordering Information

• Conga-SMC1/SMARC-x86 (p/n: LF000990): Conga-SMC1/SMARC-X86 Compact 3.5" Carrier Board for x86 SMARC 2.0 Modules
• Conga-SMC1/SMARC-x86 Cooling (p/n: LF002722): Active Cooling Solution adapter for SMARC 2.1 Modules used in conjunction with module heatspreader