Features

• 8th Generation Intel® Core™ processor with up to 6 Cores
• Intel® Xeon® processors for data center applications
• Support for USB 3.1 Gen2 with 10Gb/s
• Intel® Optane™ memory support
• ECC memory support
• Up to 32 GByte dual channel DDR4 memory

Specification

CPU:
Intel® Core™ i7-8850H (6 x 2.6 / 4.3 GHz, 9MB cache, 45W)
Intel® Core™ i5-8400H (4 x 2.5 / 4.2 GHz, 8MB cache, 45W)
Intel® Xeon™ E-2176M (6 x 2.7 / 4.4 GHz, 12MB cache, 45W)

DRAM:
2 Sockets, SO-DIMM DDR4 up to 2666 MT/s and 32GByte dual channel, optionally with ECC support (Intel® Xeon™)

Chipset:
Mobile Intel® PCH-H QM370 Series or CM246 Series for Intel® Xeon™ Processor

Ethernet:
Intel® i219-LM GbE LAN Controller with AMT 12.0 support

I/O Interfaces:
8 x PCI Express GEN 3.0 lanes
4 x Serial ATA Gen 3
4 x USB 3.1 Gen 2 @ 10 GB/s
8 x USB 2.0
1 x PEG x16 Gen 3
LPC bus
I²C bus (fast mode, 400 kHz, multi-master)
2 x UART

Sound:
Digital High Definition Audio Interface with support for multiple audio codecs

Graphics:
Intel® Gen9 UHD Graphics Engine with OpenCL 2.0, OpenGL 4.3 / 4.4 and DirectX 11/12 (for Windows 10) support up to three independent displays: HDMI 1.4a / DisplayPort 1.2 / eDP 1.4 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support@ 40 MBit/s | HEVC, VP9 and VDENC encoding

Congatec Board Controller:
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control

Embedded BIOS Features:
AMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash

Security:
The conga-TS370 is equipped with a discrete "Trusted Platform Module" (TPM 2.0)

Power Management:
ACPI 4.0 with battery support

Operating Systems:
Microsoft® Windows® 10 (64bit only)
Microsoft® Windows® 10 10 IoT Enterprise (64bit only)
Linux

Power Consumption:
See User's Guide for full details

Temperature:
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C

Humidity:
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Video Interfaces:
3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional) Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPI

Size:
95 x 125 mm

• Conga-TS370/i7-8850H (p/n: TA003203J): COM Express Type 6 Basic Module with Coffee Lake-H Intel Core i7-8850H hexa core processor with 2.6GHz, 9MB L2 cache, GT2 Graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0
• Conga-TS370/i5-8400H (p/n: TA003205J): COM Express Type 6 Basic Module with Coffee Lake-H Intel Core i5-8400H quad core processor with 2.5GHz, 8MB L2 cache, GT2 Graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0
• Conga-TS370/E-2176 (p/n: TA003204J): COM Express Type 6 Basic Module with Coffee Lake-H Intel Xeon Processor E-2176M hexa core processor with 2.7GHz, 12MB L2 cache, GT2 Graphics and 2666MT/s dual channel DDR4 memory interface. Chipset CM246. TPM 2.0